Inspiring the Evolution of Embedded Design

June 06, 2023

Analog and Power

onsemi will Integrate its EliteSiC MOSFETS into Sineng’s Utility-Scale Solar Inverter

onsemi is working with Sineng Electric to bring a utility-scale solar inverter to market. The initiative is a collaboration between the two companies and will launch the first 200kW Energy Storage System (ESS).

The two companies announced the collaboration just 21 days ago.

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CoolGaN 600 V GIT HEMT Portfolio is Delivering High Performance and Quality

 Infineon has developed the latest in GaN-integrated power stage (IPS) devices including the GIT-HEMT devices. The IPS devices offer more flexibility to meet specific needs in development.

The discrete CoolGaN GIT-HEMT devices are available in DSO-20-85, DSO-20-87, HSOF-8-3, LSON-81, and TSON-8 packages.


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Renesas RAA210130 is a Fully PMBus Enabled Step Down Power Supply

Renesas has developed a power supply that is capable of delivering up to 30A of current from a compact 10mm x 13mm x 7.8mm thermally enhanced BGA package.

The RAA210130 operates across an input voltage range of 4.75V to 15V. The power supply offers adjustable output voltages down to 0.45V with a 96% efficiency according to Renesas.

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Editor's Desk by Stephen Vicinanza


The Way Forward in Power Components is a bit Cloudy

Circuit Cellar fans, let's talk about the SiC, Si, and GaN jumble.

In many respects, the trending articles on the semiconductor front have been that there is a war between the material base for semiconductors.

It is cloudy at best, due to a number of factors, not the least of which is availability. Not all materials are applicable to all types of applications. The cost of GaN mining is higher than that of silicon manufacture, and the elements are similar and could work together. The truth is, there is a murky relationship between silicon manufacturers and the Gallium Nitride developers. The resistance is seen as wavering, but it still exists.

The largest SiC and Si manufacturers are hanging on to their products with an iron grip.

While the GaN developers are pushing low cost and reduced sizes for the same overall processing and output capabilities. And this struggle is producing some unlikely innovations and advancements in all three materials' processing and manufacturing. Read more about this in the newsletter articles. Let's keep this conversation going. Have a thought? Let me know.


Keep an eye on this space for more.


What would you like to see, more editorial or less, more of a particular topic, or less? Let us know. Reach out to the Product Editor

Latest News

GEEKOM launches AS 6 and AS 5 AMD-based mini-PCs


The company GEEKOM launched today two mini-PCs built around the Ryzen 9 and Ryzen 7 AMD processors. The AS 6 supports DDR5 memory, 8K video output, up to 2TB of storage, and multiple I/O ports.

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