Inspiring the Evolution of Embedded Design

December 06, 2022

Analog and Power

Apex SiC Provides High Power in a Half-Bridge Module

Apex Microtechnology has released an analog module series that provides Silicon Carbide (SiC) technology in a functional package design. The modules are half-bridge mounted on the surface expanding thermal efficiency and power density.

The Apex SA111 has a surface-mounted 20mm x 20mm body and can provide continuous output currents at 32A, is able to reach switching frequencies up to 1MHz, and manage supply voltages up to 650V. 

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Onsemi Launches Top-Cool MOSFETs That Could be Innovative

onsemi launched a top-cool MOSFET that could be an innovation to other MOSFETs. These new MOSFET devices were announced just in November 2022, featuring a new top-side cooling to assist designers who are tackling those challenging automotive applications.

The focus for these MOSFETs is on motor control and DC-DC conversion. The company is showing new devices at electronica, this year.

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EPC Launches new eGaN Technology Doubling Performance

EPC launches a new eGaN technology that doubles the performance of previous solutions. Efficient Power Conversion (EPC) introduces the 80V, 4mOhm EPC2619 GaN FET in a 1.5mm x 2.5mm package. This FET offers higher performance and smaller solution sizes than the traditional MOSFETs found on the market today.

The EPC2619 offers high power density for applications including DC-DC conversion, motor drives, and synchronous rectification for the 12V – 20V ranges.

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Editor's Desk by Stephen Vicinanza


Analog Power Heats Up SiC and GaN


The battle between Si, SiC, and GaN is ever-raging behind the scenes. Vertical GaN and the latest eGaN FETs are being developed by major manufacturers, and they are small and powerful. Some FETs are doubling performance over their Si and SiC competitors.

But the SiC market still thrives with the largest manufacturers, and although the future does not look as bright, the high-power MOSFETs are doing well in the marketplace.

There is a growing contingent that follows the growth of GaN technologies and there is widening demand across designers.

Mass production of the eGaN technology is beginning in Q1 of 2023, so already customers are buying the FETS in volume.

But new high-performance high power density is controlling the market for SiC MOSFETs, the average SiC MOSFET is three times the size of a GaN of the same performance level, but the industry loves silicon and is holding tight to its uses.

Apex Microtechnologies and onsemi are pushing forward with Silicon-based devices and modules, while EPC moves deeper into the GaN industry. Both industries are selling growth, but the waiting game is now here as GaN catches up to Si in the marketplace.


Join us next week as we take a dive into what is happening with the Microcontroller Watch.   I am always available for questions just reach out to product-editor@circuitcellar.com

Latest News

Rugged Edge Mini-PC equipped with i.MX 8M Plus and dual 2.5GbE LAN ports


Last week, iBASE released a fanless Mini-PC based on the quad-core i.MX 8M Plus processor from NXP. The ISR215 also includes one HDMI 2.0 port, M.2 Key-B (3052) for 5G connectivity and it can be configured with up to 4GB LPDDR4/128GB eMMC. 

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