New Global Ecosystem Introduced by MediaTek

New global ecosystem introduced by MediaTek. These are consumer-ready Wi-Fi 7 products being showcased at CES 2023.

MediaTek will be demonstrating a full ecosystem of production-ready devices all featuring next-gen connectivity for wireless development. The products in this demonstration are being featured for the first time at Consumer Electronics Show 2023 in Las Vegas, NV, USA.

Altronix Showcases Power and Data Transfer

Just about a month ago, Altronix showcased its latest power and data transfer products at ISC in New York City. The company has stated its solutions increase system capacity while taking up less space in overall design situations.

This enables more edge devices to be deployed at greater distances with an increase in power to accommodate a wider range of surveillance and security systems. The company is saying this enables devices to be deployed in remote locations regardless of local power availability.

Infineon Introduces CoolGaN, the Latest in Their GaN Offerings

Power conversion is a large market today. Expectations of longer battery life drive the demand for high-performance and low-cost power products. This drive is also focused on faster communications and more relevant and capable Artificial Intelligence (AI) systems. This also needs to be delivered at a lower cost, from the huge network of hyperscale data centers, 5G integrations, and telecom server farms, being added to our routines in life.

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Editor's Desk by Stephen Vicinanza

Gallium Nitride is Difficult to Nail Down

Gallium Nitride (GaN) will be a $21 billion dollar market this new year. And what better way to start off the new year than speaking about its growth? But

The roadblocks to vertical GaN remain, and the fabricators are cautious when it comes to GaN on GaN technologies, even though the benefits would be wide-ranging. The drawbacks are substantial.

Growing a Gallium Nitride crystal is difficult, and time-consuming. The process today is better served on a substrate like Silicon Carbide.

In order to estimate what it would take to produce vertical GaN products at scale, there would need to be a reckoning of time. Time-to-market is longer, time to deliver products is farther out into the future, and a way to reduce the growth difficulties is nowhere in sight.

The benefits are higher performance in a smaller space, and greater efficiency and reliability.

The trade-offs are proving to be leaning toward more GaN and less Silicon, but the giants in fabrication are pushing for a mix of materials.

In the new year we will be asking for opinions, what would you like to see, more editorial or less, more of a particular topic, or less? Let us know. Reach out to the Product Editor

I am always available for questions just reach out to product-editor@circuitcellar.com

Low-Power BLE/NFC modules support Azure RTOS and FreeRTOS

The CBT250 from CEL is a low-power IoT module built around the QN9090 Bluetooth 5.0/NFC chipset from NXP Semiconductors. This module integrates a Cortex-M4 processor clocked at 48MHz and it also offers support for various interfaces such as I2C, SPI, UART, PWM, I2S, etc.