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| Buck Converter Extends Battery Life
of USB Type-C Gear
Maxim Integrated Products offers the MAX77756, a 24 V, 500 mA, low quiescent (IQ) current buck converter that will help developers of multi-cell, USB Type-C products in need of higher current, dual input and I2C support. USB Type-C products must generate an always-on 3.3 V rail to detect USB insertions. Products utilizing the Power Delivery (PD) voltage range (5 V to 20 V) can generate an always-on (1.8 V / 3.3 V / 5.0 V) digital supply rail for the port controller using the MAX77756 step-down converter. In addition, the MAX77756 has a 20 μA quiescent current that extends battery life by reducing idle power consumption. To simplify the system design, the MAX77756 has a dual input ideal diode ORing circuit that allows the chip to power from the external USB source if the battery is empty. CONTINUE READING Analog Devices Collaborates on IoT Farm-to-Fork Project Analog Devices has announced a collaboration with The Cornucopia Project and ripe.io to explore the local food supply chain and use this work as a vehicle for educating students at ConVal Regional High School in Peterborough, NH and local farmers on 21st century agricultural skills. The initiative instructs student farmers on how to use Internet-of-Things (IoT), blockchain technologies to track the conditions and movement of produce from "Farm to Fork", and to make decisions that improve quality, yields, and profitability. For the project, Analog Devices is providing a prototype version of its crop monitoring solution, which will be capable of measuring environmental factors that help farmers make sound decisions about crops related to irrigation, fertilization, pest management, and harvesting. The sensor-to-cloud, IoT solution enables farmers to make better decisions based on accumulated learning from the near-real-time monitoring. CONTINUE READING |
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MOSFET is Drop-In Replacement for DPAK Footprint Infineon Technologies is expanding its recently launched CoolMOS P7 superjunction power MOSFET family with a SOT-223 package. The device has been developed as a one-to-one drop-in replacement for DPAK. It is fully compatible with a typical DPAK footprint. The combination of the new CoolMOS P7 platform with the SOT-223 package is a perfect fit for applications such as smartphone chargers, laptop adapters, TV power supplies, and lighting. The new power MOSFET CoolMOS P7 is designed to address needs of the low power SMPS market. It uses price competitive, superjunction technology, which results in a reduced overall Bill of Materials (BOM) on the user side. The thermal behavior of the CoolMOS P7 in this package was assessed across several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by 2°C to 3 °C compared to a standard DPAK. And for copper areas of 20 mm² or more, the thermal performance was equal to that of DPAK. The CoolMOS P7 in SOT-223 is available in 600 V, 700 V, and 800 V devices.
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Current Multipliers Improve Processor Performance
Vicor has announced the introduction of Power-on-Package modular current multipliers for high performance, high current, CPU/GPU/ASIC ("XPU") processors. By freeing up XPU socket pins and eliminating losses associated with delivery of current from the motherboard to the XPU, Vicor's Power-on-Package solution enables higher current delivery for maximum XPU performance. In response to the ever-increasing demands of high performance applications (artificial intelligence, machine learning, big data mining, etc) XPU operating currents have risen to hundreds of Amps. Point-of-Load power architectures in which high current power delivery units are placed close to the XPU, mitigate power distribution losses on the motherboard but do nothing to lessen interconnect challenges between the XPU and the motherboard. With increasing XPU currents, the remaining short distance to the XPU consisting of motherboard conductors and interconnects within the XPU socket, has become a limiting factor in XPU performance and total system efficiency.
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Embedded Connectivity and Tech Conference 2017 Whether it's embedded hardware design or the Internet of Things (IoT),
the Embedded Connectivity and Tech Conference (ECTC) of 2017 will showcase emerging trends and innovations that will set the tone for the embedded systems industry in 2017 and beyond.
Download the ECTC 2017 brochure for all the information on speakers, sessions, and so much more!
The event is scheduled for September 28 - 29, 2017 at Chancery Pavillion, Bengaluru. REGISTER NOW
Industry News & Recent Posts
Telit has announced the LM940, a global Full PCI Express Mini Card (mPCIe) module for supporting LTE Advanced Category 11 (Cat 11) with speeds of up to 600 Mbps, available with various mobile network operator approvals in the fourth quarter. ... Continue reading →...» Data Conversion, Capacitive Sensing, and More: In the previous parts of this series, Nishant Mittal laid the groundwork for getting up and running with the PSoC. Here he tackles the chip's more complex features like Data Conversion and CapSense. ... Continue reading →...» Team successfully marries a CMOS IC with graphene, resulting in a camera able to image visible and infrared light simultaneously. ... Continue reading →...» Anaren IoT Group has announced the release of version 2.1 of its innovative Anaren Atmosphere online development platform. Atmosphere affords embedded, mobile, and cloud developers an exceptionally fast way to create IoT applications with an easy-to-use IoT development environment. ... Continue reading →...» Axiomtek has announced its latest COM Express Type 10 Mini Module, the CEM311. The CEM311 is scalable and features an Intel Celeron processor N3350 or an Intel Pentium processor N4200. ... Continue reading →...» For many new embedded applications, an 8-bit MCU is just right. Pedro Bertoleti shows how to build a time-oriented task manager using Microchip's PIC 16F628A 8-bit microcontroller. ... Continue reading →...» |
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