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COMe Type 7 Card Sports AMD EPYC Embedded 3000 Processor
Congatec has introduced its first Server-on-Module (SoM) with AMD embedded server technology. The new conga-B7E3 Server-on-Module with AMD EPYC Embedded 3000 processor offers up to 52% more instructions per clock compared to legacy architectures, according to the company. Use cases include Industry 4.0, smart robot cells with collaborative robotics, autonomous robotic and logistics vehicles, as well as virtualized on-premise equipment in harsh environments to perform functions such as industrial routing, firewall security and VPN technologies---optionally in combination with various real-time controls and neural network computing for Artificial Intelligence (AI).
The conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12 or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1 TB in full custom designs. Measuring just 125 mm x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives.
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Rugged Computers Run Linux on Jetson TX2 and Xavier
Aitech has announced that Concurrent Real-Time's hardened RedHawk Linux RTOS will be available on two Linux-ready embedded systems based on the Nvidia Jetson TX2 module. With Redhawk Linux standing in for the default Nvidia Linux4Tegra stack, the military-grade A176 Cyclone and recently released, industrial-focused A177 Twister systems can "enhance real-time computing for mission-critical applications," says Aitech.
Here, we'll take a closer look at the A177 Twister (shown), which was announced in October as a video capture focused variant of the similar, mil/aero targeted A176 Cyclone. Both of these "SWaP-optimized (size, weight and power) supercomputers" are members of Aitech's family of GPGPU RediBuilt computers, which also include PowerPC and Intel Core based systems. We'll also briefly examine an "EV178 Development System" for an Nvidia Xavier based A178 Thunder system that was revealed at Embedded World. The A178 Thunder targets mil/aero, as well as autonomous vehicles and other applications.
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Enclustra FPGA ModulesPower Electric Racing Car Formula Student is the largest engineering competition in the world. The Zurich/Switzerland based AMZ student team managed to put itself top of the world rankings, also thanks to the innovative, FPGA module-based approach for the electric drivetrain. Four self-developed inverters control one motor each. A self-developed direct torque control (DTC) modulator is running on a Xilinx Zynq 7015 FPGA-System-on-Chip based Mercury ZX5 SoC module from FPGA expert Enclustra. VHDL implementation makes it possible to estimate the current state of the motor and calculate the new switching positions every 10 ns---capabilities not possible with a microcontroller- or DSP based system. The module-based approach reduced development time and risk significantly. The Mercury ZX5 SoC module provided exactly all needed functionality on one single small PCB. The module even can power circuits on the base board, minimizing the need for power converters. READ MORE HERE | Current Issue SEE INSIDE Subscriber Login
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Latest UP Board Combines Whiskey Lake with AI Core X Modules
Aaeon has posted specs for a Linux-ready "UP Xtreme" SBC with a 15 W, 8th Gen Whiskey Lake-U CPU, up to 16 GB DDR4 and 128 GB eMMC, 2x GbE, 6x USB, SATA and optional AI Core X modules via M.2 and mini-PCIe. Aaeon's community-backed UP project, which most recently brought us the Intel Apollo Lake based Up Squared and UP Core Plus SBCs, has announced an UP Xtreme hacker board built around Intel's 8th Gen Whiskey Lake U-series Core processors. This is likely the fastest open-spec, community-backed SBC around, depending on your definition.
The only SBCs we've seen announced with the 14 nm fabricated Whiskey Lake are Congatec's 3.5-inch Conga-JC370 and thin Mini-ITX Conga-IC370. The Whiskey Lake U-series chips are notable for providing quad-core configurations with the same 15 W TDPs of Intel's earlier dual-core U-series chips. The quad-core models offer a performance increase of up to 40% compared to previous U-Series processors.
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Tiny, Octa-Core Arm Module Targets AI on the Edge
Qualcomm's octa-core Snapdragon 660 appeared on Intrinsyc's Open-Q 660 HDK Mini-ITX dev kit back in 2017 and also showed up on an Inforce 6560 Pico-ITX SBC announced in February. Now Intrinsyc has returned with a tiny compute module implementation. The $225 Open-Q 660 µSOM (micro System on Module) measures only 50 mm x 25mm. Applications for the Open-Q 660 μSOM include on-device artificial intelligence, enhanced gaming, power optimization, device management, security and advanced photography and image processing jobs such as camera and audio tuning. Intrinysc mentions a development kit that will connect to the module via its 3x 100-pin board to board connectors, but there were no further details.
The module runs Android 9.0 on the Snapdragon 660 (Qualcomm SDA660), which is claimed to offer up to 20% higher CPU performance and 30% higher graphics performance compared to the similarly octa-core Snapdragon 653. The Snapdragon 660 is also faster than the octa-core Snapdragon 625 and almost identical Snapdragon 626 thanks to its use of Cortex-A73-like "Kryo" cores.
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Whiskey-Lake U Processor Rides COM Express Type 6 Module
TQ Systems has released a COM Express Compact Type 6 module TQMx80UC based on the 8th generation Intel Core Mobile Processors code named "Whiskey-Lake U". This module is well suited for industrial controllers, robotics applications, medical devices and point-of-sales. Depending on the required functionality and computing power, several CPU variants (i7, i5, i3, Pentium, Celeron) with two or four cores can be selected. With a thermal power loss of 15 W TDP, four cores are now available for the first time in this performance class (previously two for the 7th generation U series).
The memory interface is equipped with the fast DDR4-2400 technology. The memory capacity can be selected between 4 GB and 64 GB depending on the SO-DIMM modules used. Up to nine PCI Express lanes (Gen3; 8 GHz) are available for connecting up to five peripheral devices and can be flexibly configured in the BIOS. For the first time, the new USB 3.1 Gen2 standard is supported, which allows transfer rates of up to 10 Gbit/s.
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Industry News & Recent Posts
Dialog Semiconductor has announced its SmartBond DA1469x family of Bluetooth low energy SoCs, a range of multi-core MCUs for wireless connectivity. The devices' three integrated cores have each been carefully chosen for their capabilities to sense, process and communicate between connected devices, says Dialog. ... Continue reading →...»
Texas Instruments (TI) has introduced two new RF-sampling transceivers that integrate four analog-to-digital converters (ADCs) and four digital-to-analog converters (DACs) in a single chip. TI says the device offers the industry's widest frequency range, highest instantaneous bandwidth and 75% smaller design footprint than a discrete solution. ... Continue reading →...»
NXP Semiconductors has unveiled an MCU based voice control solution qualified with Amazon's Alexa Voice Service (AVS). This enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add voice control to their products, giving their customers access to richrich voice experiences with Alexa. ... Continue reading →...»
TDK has announced the addition of a 960 W rated model to its DRF series of AC-DC DIN rail mount power supplies. The high 95% efficiency produces less internal waste heat enabling electrolytic capacitors to run cooler, providing a calculated life of in excess of eleven years with a 75% load at 230 Vac input. ... Continue reading →...»
Building Boards that Bend While not exactly a brand-new technology, flexible printed circuit boards are a critical part of many of today's challenging embedded system applications from wearable devices to mobile healthcare electronics. The PCB production service vendors listed here feature a variety of Flex PCB manufacturing services to help bring your embedded system design from prototype to production. ... Continue reading →...» |
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