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Your feedback is always welcome. - Jeff Child (JChild@circuitcellar.com)
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| Arm-based SBC has PoE, Wi-Fi/BT and More
Gateworks' headless "Ventana GW5910" SBC runs OpenWrt or Ubuntu on a dual-core i.MX6 and provides GbE with PoE, WiFi/BT, optional GPS, Sub-1 GHz and 2.4 GHz radios, and dual mini-PCIe slots for further wireless expansion. Freescale's i.MX6 was ahead of its time when it launched in 2011, and in the NXP era it it has continued to hold on in the embedded Linux market far longer and with greater dominance than any other processor. It's only a matter of time before i.MX6-focused embedded vendors like Gateworks move on to the i.MX8 or other SoCs, but in the meantime there's something to be said for working with a consistent SoC and platform/software platform rather than starting from scratch every few years. Gateworks has added to its i.MX6 collection by posting a product page for a new member of its Linux-supported, i.MX6-driven Ventana SBC family. Like other Ventana boards, the headless, wireless-oriented Ventana GW5910 supports -40°C to 85°C temperatures.
Congatec Rolls Out Ten Modules Based on Coffee Lake H Processors
Congatec has announced 10 new COM Express Type 6 modules featuring the latest Intel embedded processor technology. The four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors are all based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables Congatec to provide all 10 new processors on one COM Express module design: the conga-TS370. A total of 14 processor module variants are now available on this single microarchitecture, offering extremely wide scalability. The spearhead in terms of computing power is the 45 W 6-core module with 2.8 GHz Intel Xeon E-2276ME processor. It provides the highest embedded computing performance with integrated high-performance processor graphics currently available worldwide, while the 2.4 GHz Intel Celeron G4930E processor module with 35 W sets the new price-performance benchmark. |
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| PICMG to Develop COM Open Spec for Server-Level Edge Computing
PICMG has announced that it has recently formed the COM-HPC technical subcommittee. It is actively developing a new COM (Computer-On-Module) specification to meet the increasing requirements of edge computing applications. Well suited for a wide range of applications, PICMG's popular COM Express has been adopted worldwide and is anticipated to grow and thrive over the next decade. PICMG members have long been at the forefront of designing and supplying edge computing solutions and are collaborating to meet the requirements of applications well into the future. PICMG says the new COM specification under development is in parallel to existing COM Express efforts. This effort is intended to complement rather than be a replacement for COM Express The subcommittee will develop a next-generation COM standard and an accompanying Carrier Design Guide.
Win a Free CD with a Year's Worth of Circuit Cellar Content! This week's newsletter raffle is for a 2018 archive CD of Circuit Cellar magazine. Enter the drawing using the link below. The CD contains PDFs for 12 issues and the associated article code files. A $40 value! Drawing ends at midnight this coming Friday.
And congratulations to last week's raffle winner, Carl T., who won a 1 year subscription to Circuit Cellar. Thanks to all who participated! |
Submit Your Technical Article to Circuit Cellar Magazine
 Circuit Cellar magazine is always looking for top-notch technical articles that help readers better understand embedded electronics technology in action. Professional engineers, academics, students and serious electronics enthusiasts are encouraged to submit articles and proposals. Whether its a project-based article, an article about a technology trend, or an analysis of a technical issue or challenge, Circuit Cellar is looking for insightful, detailed articles that help its readers do their jobs as embedded system designers. If you have an article or an article proposal, let us know! Our article submissions page provides you with our requirements and guidelines. Ryzen Embedded V1000 Module Supports Four USB 3.1 Ports
Ibase has announced a COM Express Type 6 module equipped with AMD's Ryzen Embedded V1000 system-on-chip. The announcement refers to the ET876 as a Compact module (95 x 95mm) like Ibase's earlier, Intel 7th Gen "Kaby Lake" ET975, but the spec sheet and the photo indicate it's a larger 125 mm x 95 mm Basic module like Ibase's 7th Gen ET970. 
The ET976 follows other V1000-based COM Express Type 6 modules including Seco's Compact COMe-B75-CT6, Kontron's Compact COMe-cVR6, Advantech's Basic SOM-5871, and MEN Micro's Basic CB71C. The Kontron and MEN Micro modules also support the new stripped-down Ryzen Embedded R1000. Ibase listed no OS support for the ET976, but all the other V1000-based modules either ship with Linux as the default or support Linux and Windows. The module supports the dual-core V1202B and the quad-core V1605B, V1807B, and V1807B SoCs at up to 3.8GHz. Applications include graphics-intensive devices used in industrial automation, medical imaging, transportation, gaming, payment systems and ATM machines. CONTINUE READING
PCB Assembly - $1000 in FREE Labor
 SlingShot is Offering Free Labor for 1st Time Customers! They are changing the game in PCB assembly. Doing the impossible, everyday. For a limited time, SlingShot Assembly is offering FREE LABOR, up to $1,000, on new customers' first turn-key order. Their 5-day turn includes parts, boards AND assembly. SlingShot Assembly challenges you to try something different.
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Low-Profile SDM Signage Board Features Whiskey Lake-U
Axiomtek has launched an SDM form-factor "SDM500L" signage board with an 8th Gen Whiskey Lake-U processor with triple 4K display support, up to 32 GB RAM, 3x M.2 sockets, and extended temperature support. Like the 6th Gen Skylake-based Nexcom NDiS S538 that we covered earlier this week, Axiomtek's new SDM500L signage computer conforms to Intel's Smart Display Module-Large  (SDM-L) form factor, a sleeker version of its OPS (Open Pluggable Specification).
It's similarly designed to be integrated with SDM compliant displays via a PCIe x8 edge interface in special cabinetry aimed at locations with space constraints. Like OPS, SDM also supports remote management. Like the Nexcom product, the 175 mm x 100 mm x 1.6 mm SDM500L board lacks external housing and offers a mounting bracket and panel for the coastline ports. This would appear to boost the width to the SDM-L standard 20 mm. The product lacks the fan and top covering of the NDiS S538. CONTINUE READING
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