PICMG Approves COM-HPC Pinout, SMARC Module has i.MX8X, COM Express Board Serves Up 2GHz Ryzen
Inspiring the Evolution of Embedded Design
November 26, 2019
Focus: Embedded Boards
PICMG Committee Approves
COM-HPC Pinout
The PICMG COM-HPC technical subcommittee has approved the pinout of its high-performance Computer-on-Module specification, according to Congatec. The new COM-HPC standard is now entering the home stretch for the ratification of version 1.0 of the specification, which is scheduled for the first half of 2020.
COM Express Family Adds New AMD 2GHz Ryzen Variants
Kontron has expanded its portfolio of COMe-cVR6 (E2) Computer-on-Modules in the COM Express Compact Type 6 form factor with new variants. They include the latest AMD Ryzen embedded processor V1404I with 4x 2.0GHz and a power consumption of 12W to 25W. Versions with ECC memory down or with DDR4 SO-DIMM socket are possible.
Computer-on-Modules for AI-Based Industrial Vision Systems
Vision and artificial intelligence (AI) are megatrends in automation, Industry 4.0 and cyber-virtual factories. Embedded computer technologies for such systems have to meet increasingly complex demands. With their high scalability, Computer-on-Modules can provide the necessary flexibility and, as convergent components, are even suitable for closed-loop engineering.
Boardcon has launched a “EM-IMX8M-MINI” SBC built around a “SOM-IMX8M-MINI” module that runs Linux on a quad -A53 i.MX8M Mini with 2GB LPDDR4, 8GB eMMC and Wi-Fi/BT. The SBC adds MIPI-DSI/CSI, GbE, USB, serial, CAN and M.2.
Mini Type 10 Dev Board Supports Extended Mini-PCIe I/O Modules
Acromag announced a Mini-ITX form-factor carrier board for COM Express Mini Type 10 modules sold in three configurations: barebones (ACEX4041); equipped with an Intel Apollo Lake Mini Type 10 module (ACEX4041-2000); or a Development Lab System sold with the Apollo Lake module and 1TB storage (DLS4041-2110).
Advantech’s “ROM-5620” SMARC 2.0 module runs Linux or Android on a dual- or quad-core i.MX8X and offers 2GB LPDDR4, 16GB eMMC and optional industrial temperature support. The module is available with open source Linux and Android BSPs, which include test utilities, hardware design utilities and reference drivers.
With today’s level of integrated chip technology, board-level embedded computers can now literally fit in the palm of your hand. This “tiny” category of board-level computing products meets the needs of applications where extremely low SWaP (size, weight and power) is a priority over other requirements.
