Inspiring the Evolution of Embedded Design

September 10, 2024


Small Chips, Bigger Dreams

AMD Unveils Next-Gen “Zen 5” Ryzen Processors to Power Advanced AI Experiences

For desktop PCs, the new AMD Ryzen 9000 Series desktop processors represent a significant step forward, offering users cutting-edge computing power and reliability. Built on the latest “Zen 5” architecture, AMD Ryzen 9000 Series desktop processors deliver an impressive average16% better IPC performance compared to the prior generation of Ryzen processors’ “Zen 4” architecture4, with the top-of-the-line Ryzen 9 9950X delivering the fastest consumer desktop performance in the world5.

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MYIR Introduces Nuvoton NuMicro MA35D1-Based SOM For Advanced Edge IIoT Gateways

The MYC-LMA35 incorporates 256MB of DDR3L memory integrated within the MA35D1 MPU, along with external storage options of either 256MB Nand Flash or 8GB eMMC, and a 32Kbit EEPROM. Crafted in an LGA package featuring a 252-pin expansion interface, it supports a vast array of peripheral and IO signals, including 17x UART, 4x CAN FD, 2x Gigabit Ethernet, 2x USB 2.0 HS, 1x SDIO3.0, 1x RGB, 1x CSI, and 2x I2S, thereby fully exploring the capabilities of the MA35D1 processor.

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Nordic Semiconductor Launches Smallest and Lowest Power SiP and Dev Kit

The nRF9151 stands out from the nRF9160 and nRF9161 with its exclusive features, such as a significant footprint reduction, which allows for more compact products without performance compromises. In addition to Power class 3 (23 dBm), the nRF9151 also supports Power class 5 (20 dBm) output power, leading to 45 percent reduced peak power consumption thanks to the unique nRF9151 low power design, which decreases the cost of battery-powered products. The nRF9151 will also add support for Non-Terrestrial Network (NTN) support in future firmware release.

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Editor's Desk by Kirsten Campbell



How the Smallest SiPs and Their Development Kits Are Leading the Charge to the Future

Small and low power System-in-Package (SiP) solutions, along with their dev kits have the power to push the boundaries of miniaturization. Compact, integrated solutions are necessary for devices like wearables, IoT systems, and medical equipment.


One of the standout features of low-power SiPs is their ability to extend battery life and reduce energy consumption. As the demand for energy-efficient solutions grows, microcontrollers will depend on energy conservation to keep devices competitive.


By integrating multiple components into a single SiP package, manufacturers can lower the overall cost of production and assembly. As SiP technology becomes cheaper, it will make advanced microcontroller solutions more accessible across different industries, democratizing innovation and driving broader adoption. Yay!

Modern SiPs and DKs are designed to be compatible with emerging standards and technologies, ensuring that devices incorporating these solutions remain relevant as new technologies and standards evolve. This future-proofing capability ensures long-term usability and adaptability, making it easier for developers to create products that stay ahead of the curve. As technology continues to advance, the impact of these tiny powerhouses will be felt across a wide range of industries, ushering in a new era of microcontroller innovation.


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Latest News

HaloMax Product Line for Long-Range, Low-Power Wireless Solutions

Teledatics’ HaloMax, recently featured on CrowdSupply, is a long-range wireless module designed for applications like smart agriculture, industrial control, and HAM radio. Operating in the sub-1 GHz band, it delivers reliable, power-efficient communication over extended distances with FCC-allowed maximum output power.

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September 2024 - Issue #410

Manufacturing IoT Trends



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