Inspiring the Evolution of Embedded Design

June 11, 2024


Microcontrollers

OmniOn Power Improves Remote Power Systems Access and Security with RADIUS Client Module Addition 

OmniOn’s RADIUS Client modules measure approximately 4 square inches and can be mounted on the inside of a power system door next to the system controller. The module is able to integrate with OmniOn’s Millennium 2, Pulsar Plus and Pulsar Edge controllers and is available as a factory-installed option for new power systems and can be retrofitted into existing, deployed systems. 

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ENNOVI Introduces Stackable Multi-Row Board-to-Board Connector Platform That Snaps Together Without Solder

ENNOVI-MB2B connectors are available in board stacking heights from 7mm to 30mm. They can have between 1 and 6 rows, with up to 30 contact terminals being incorporated into each row.


Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (8 hour cycling up to 10% RH), mechanical shock (35g for 5 to 10ms across 10 axes) and vibration (8 hour per axis). A working temperature range of -40°C to +150°C is supported.

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Microchip Expands Microcontroller Portfolio with 32-bit SAMD21RT Arm® Cortex®-M0+ Based MCU for the Aerospace and Defense Market

The SAMD21RT device builds on Microchip’s existing family of SAMD21 MCUs, which is widely used in industrial and automotive markets. It is also based on Commercial-Off-The-Shelf (COTS) devices, which significantly simplifies the design process when transitioning to a radiation-tolerant device as the design remains pinout compatible.


Microchip offers a comprehensive system solution for space applications with many devices that can be designed around the SAMD21RT MCU including FPGAs, power and discrete devices, memory products, communication interfaces and oscillators providing a broad range of options across qualification levels.

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Editor's Desk by Kirsten Campbell



Microcontrollers and the Future of Electronic Assembly

Microcontrollers manage tasks from simple operations to complex calculations. Their versatility and power make them indispensable in today's technology.


Complementing the power of microcontrollers is the advent of solder-free, stackable multi-row board-to-board connectors. These connectors represent a significant leap in electronic assembly and design. Traditionally, connecting boards required soldering, a meticulous and time-consuming process that also introduces potential points of failure. The new snap-together connectors eliminate these issues, offering a faster, cleaner, and more reliable way to assemble multi-board systems.

The combination of microcontrollers and solder-free connectors brings advantages like:

  • Enhanced Flexibility: Designers can easily reconfigure and expand systems without the need for soldering, making prototyping and iterative development much more agile.
  • Increased Reliability: The elimination of solder joints reduces the risk of connection failures, leading to more durable and long-lasting products.
  • Streamlined Production: Assembly becomes quicker and less labor-intensive, reducing manufacturing costs and time to market.
  • Environmental Benefits: Solder-free connections mean fewer hazardous materials and less energy consumption during manufacturing, contributing to greener production processes.


What's next for these electronic solutions?


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Latest News

AAEON UP Xtreme i14 Series Featuring 125H/155H Intel Processors Now Available for Pre-Order

The UP Xtreme i14 series is engineered for compact computing applications in industrial and commercial settings. It supports either the Intel Core Ultra 5 processor 125H or the Intel Core Ultra 7 processor 155H, both paired with Intel Arc graphics. This series also features key interfaces such as GbE and multiple display support, accommodating a range of connectivity needs.

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