Inspiring the Evolution of Embedded Design

February 27, 2024


Toolchain Titans for Embedded Expeditions

IAR Unveils Latest Functional Safety Version of IAR Embedded Workbench Equipped With Certified Static Analysis Capabilities

The latest IAR Embedded Workbench for Arm, Functional Safety Edition, complies with the specifications of the C++17 standard and adds new Arm core support for Cortex-M55, Cortex-M85, Cortex-R52+, Cortex-R82, Cortex-A32, enabling validated compliance with key functional safety standards such as IEC 61508, ISO 26262, and IEC 62304.


It integrates powerful code analysis tools, IAR C-STAT for static analysis and IAR C-RUN for runtime analysis, to enhance software reliability and adherence to coding standards like MISRA C, CERT C, and CWE. 

Read More

Sony Semiconductor Israel Announces Commercial Availability of the Revolutionary ALT1350 LPWA Chipset

The Sony’s Altair ALT1350 is the first cellular LTE-M/NB-IoT SoC to adopt a low-power application MCU, a sensor-hub for data collection and processing, enhanced security, integrated SIM (iSIM) location technology and an additional sub-GHz LPWA/FAN customizable transceiver and NTN communication options in a single chip.


The rich feature set and performance of the chipset makes it an ideal solution for smart utility meters and single-chip asset-tracking applications. 

Read More

Vishay Intertechnology Introduces 30 V N-Channel MOSFET With Source Flip Technology to Deliver Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK® 1212-F

PowerPAK 1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation.


At the same time, the PowerPAK 1212-F minimizes the extent of the switching area, which helps to reduce the impact of trace noise. In the PowerPAK 1212-F package specifically, the source pad dimension increases by a factor of 10, from 0.36 mm² to 4.13 mm², enabling a commensurate improvement in thermal performance.

Read More

Did you know you can read full articles for FREE?

That's right - our free Starter Membership gives you access to 3 free articles a month.


Try this one:

Why Its So Hot in Here?

Thermal Basics - This article, covers the basics of thermal management so you can design circuits that don’t overheat.


Read Now

Editor's Desk by Kirsten Campbell



The Role of Toolchains in Embedded Development

Toolchains are indispensable for the advancement of tomorrow's embedded technology.


Optimization and Efficiency

Embedded boards operate in environments where resources are scarce and power efficiency is critical. Toolchains empower developers to optimize code for specific hardware configurations, ensuring that every cycle and byte is utilized to its fullest potential. Whether it's minimizing power consumption, optimizing memory usage, or fine-tuning performance, toolchains enable developers to squeeze every drop of efficiency from embedded systems.

Streamline Development Workflow

Toolchains streamline the complex development process by providing integrated environments for coding, debugging, and testing. This allows developers to focus on designing innovative solutions rather than wrestling with the intricacies of tool setup and configuration.


Cross-Platform Compatibility

Embedded systems come in diverse flavors, from microcontrollers to powerful multicore processors. Toolchains bridge the gap between different hardware platforms by providing a common development environment. Whether you're working with ARM, MIPS, or x86 architecture, a well-configured toolchain ensures that your code runs seamlessly across various embedded boards, simplifying the development and deployment process.


Toolchains provide the essential tools and infrastructure for innovation to flourish and pave the way for the next generation of embedded innovation.


What would you like to see, more editorial or less, more of a particular topic, or less? Let us know. Reach out to the Product Editor

Latest News

Asus Expands Tinker Board 3N Series with 3N Plus and 3N Lite Variants

The Tinker Board 3N is a single-board computer built around the Rockchip RK3568 System-on-Chip which was originally launched last year. Asus has expanded this lineup with two new SBC variants, designed to meet diverse requirements, from advanced computing tasks to basic functionalities.

Read More
Upcoming Events:

Techspo 2024

May 16-17 2024

New York, NY

Embedded World 2024

April 9-11, 2024

Nuremberg Germany

Current Issue

March 2024 - Issue #404

Robotics in Manufacturing



Inside this Issue


Digital Subscriber Login


Subscribe


GET PUBLISHED!

Circuit Cellar publishes articles by talented authors on electrical engineering-related topics.

More Info

Advertise with Circuit Cellar

We can get your message out to the professional engineering community. 

Contact Hugh Heinsohn today at Hugh@circuitcellar.com!

Circuit Cellar |circuitcellar.com