Cadence Design Systems has announced its Cadence Sigrity 2018 release, which includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance. A new 3D Workbench methodology bridges the gap between the mechanical and electrical domains, allowing product development teams to analyze signals that cross multiple boards quickly and accurately.
According to the company, the Sigrity 2018 release enables designers to take a holistic view of their system, extending design and analysis beyond the package and board to also include connectors and cables. An integrated 3D design and 3D analysis environment lets PCB design teams optimize the high-speed interconnect of PCBs and IC packages in the Sigrity tool and automatically implement the optimized PCB and IC package interconnect in Allegro PCB, Allegro Package Designer or Allegro SiP Layout without the need to redraw.