Allegro MicroSystems Expands Isolated Gate Driver Portfolio with Bipolar-Output Power-Thru IC

The AHV85111 gate driver packs all the benefits of Allegro’s power-thru technology, including 10x lower common-mode capacitance, a 50% smaller footprint, 10x noise reduction and a 50% efficiency improvement compared to competitor offerings, while also providing overtemperature protection that further improves the robustness of system.

Allegro’s AHV85111adds critical safety features while simplifying the design of high-power energy conversion systems for e-Mobility and clean energy applications, including OBC/DCDC, solar inverter and datacenter power supply.

ROHM Announces New Lineup of Compact SOT-223-3 600V MOSFETs

Compared to the conventional TO-252 package (6.60mm × 10.00mm × 2.30mm), ROHM’s new products reduce area and thickness by 31% and 27%, contributing to smaller, lower profile applications. At the same time, the same land pattern (footprint) as the TO-252 package can be used, enabling mounting on existing circuit boards without modification.

The user interface has been simplified to allow even newer engineers to quickly learn how to use the scope. For instance, traditional oscilloscopes need to sequentially step up or down when adjusting the time base; the MHO series has a time base matrix display, allowing users to reach any time base immediately.

There are three models in the MHO3 series: 500MHz MHO3-5004, 350MHz MHO3-3504, and 250MHz MHO3-2504, all offering a 230,000 wfm/s capture rate and a noise floor of less than 80uVrms.

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Home Controller Coordinates a Ductless Heat Pump

Build a controller that would operate the new unit only when it was more cost-effective

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Editor's Desk by Kirsten Campbell

The Incredible Shrinking MOSFETs

This magic combination of materials, architecture, and process optimization is the holy grail for engineers striving to shrink Super Junction MOSFETs while balancing high breakdown voltage and low ON resistance. So, what ingredient mix makes up this elusive recipe?

Materials

Engineers often turn to SiC and GaN for their exceptional electrical properties, boasting lower conduction losses and faster switching speeds. Their compactness and compatibility make them a pragmatic choice, seamlessly integrating into designs without cumbersome alterations.

Architecture

Trench structure design emerges as a favored option due to its ability to provide precise control over electric fields, resulting in minimized ON resistance and enhanced switching speeds compared to planar designs. This architecture allows for more compact MOSFET layouts, addressing space constraints without compromising performance.

Process Optimization

DRIE is an engineering fave for its precision and scalability. This technique tailors device geometry to exact specifics while integrating with standard semiconductor fabrication processes. The result? Simplified production and better scalability.

The debate about superior strategies continues to rage on within the engineering community. Just the kind we love here at Circuit Cellar, eh.

So what do you think? Add your voice.

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Introducing the MaTouch ESP32-S3 SPI IPS 2.8″ with Camera OV3660 by Makerfabs

Makerfabs has expanded its product lineup with the introduction of the MaTouch ESP32-S3 SPI IPS 2.8″ module, featuring the OV3660 Camera. This Makerfabs module is designed for smart applications like remote monitoring and facial recognition, offering compact dimensions and flexible storage options.

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