As vehicles become increasingly connected and driving is transformed by sophisticated ADAS and autonomous driving technologies, key trends are impacting the need for more efficient thermal management across automotive electronic components, including miniaturization, systems integration and more powerful processing.

Henkel’s next generation of thermal gap fillers are helping meet these needs through solutions tailored specifically for demanding automotive applications. Join this Webinar to learn more about how Henkel’s BERGQUIST Gap Filler TGF 4400LVO is addressing these evolving requirements through fast-dispensing speed, thin bond-line thickness, excellent wet-out, good dielectric strength, high adhesive strength and more.