This June marked the first time since records began in 1976 that IC sales in a June slumped from May of the same year, according to IC Insights.

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The global consumer service robotics market recorded 25% year-on-year shipment growth in 2021 and is estimated to grow at a CAGR of 27% over the next four years, according to the latest research from Counterpoint's IoT service.

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Many exciting projects can be implemented with the Raspberry Pi Pico. Tools, developer code and additional hardware help. For example, the new mini color display from Display Visions.

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August 5th is the tenth anniversary of the landing of the rover »Curiosity« on Mars. Husqvarna, manufacturer of robotic mowers, is marking the anniversary in its own way: With a very special update for 100,000 of its »Automower«.

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Volkswagen Group China has unveiled the first prototype of an electrically powered, vertical take-off and landing passenger drone (eVTOL). The company is thus breaking new ground in the development of all-electric and sustainable individual mobility concepts.

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Dirk Finstel is the new Managing Director and CEO of Seco Northern Europe, succeeding Stefan Heczko. He had held the position since 2020 and remains with Seco as a member of the advisory board. With Finstel, the company was able to gain a long-standing industry expert.

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The next Automotive SerDes Conference will take place as a live event on May 4, 2023 in Munich.

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Siemens Smart Infrastructure (SI), an expert in digital buildings, has completed the acquisition of Brightly Software, a U.S.-based software-as-a-service (SaaS) provider of asset and maintenance management solutions.

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Infineon Technologies offers secured NFC tags that meet high security requirements for proving authenticity.

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Electrification and networking mean that the automotive industry has to invest more and more in software. Expenditure could more than double by 2030. The way out: new design concepts in which the vehicle is built around a software platform from the outset.

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InnovationLab and ISRA have developed a new additive manufacturing process for copper-based solderable circuits whose advantages represent a breakthrough.

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