At its Intel Innovation event, the chipmaker also announced a collaboration with Dell on new AI servers and the launch of Intel Developer Cloud for building AI and HPC applications.
Glass-based substrates, which sit between the chip and connecting components, could help large and complex processors communicate, Intel researchers say.
As data centers' demand for liquid cooling systems continues to increase, strangely, so has demand for high-efficiency air cooling. It seems AI workloads may be bifurcating facility designs.