Researchers demonstrate that dust-sized photovoltaic cells grown on silicon substrate can be heterogeneously integrated with other chiplets using a high-throughput wafer-level packaging process. The ability to integrate various nanoelectronic chiplets - such as processor, memory, and photovoltaics - in an industrial-scale wafer-level-packaging process, unlocks the potential of large-scale manufacturing of these compact integrated systems with high performance and ultralow cost.
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Data-infused artificial intelligence could speed materials discovery.
New possibilities for future developments in electronic and optical devices have been unlocked by recent advancements in two-dimensional (2D) materials.
Researchers propose a new approach to describe the interaction of metals with electromagnetic fluctuations i.e., with random bursts of electric and magnetic fields.
Scientists examined the photocatalytic performances of titanate nanotubes (TNTs) against commonly-used titanium dioxide and discovered superior performance of TNTs.
Researchers have developed a high-resolution lithography process to pattern metal-organic framework (MOF) films. This work will speed up the integration of these materials into microchips.
Researchers integrated three concepts to achieve a novel graphene photodetector: metallic plasmonic antennas, ultra sub-wavelength waveguiding of light and graphene photodetection.
Scientists place another piece of the puzzle on how introducing alkali metals into crystals of thin-film flexible solar cells improves their efficiency.