Researchers have developed a novel wafer bonding technology using an optical upconversion material that transforms sunlight to shorter-wavelengths. This new semiconductor process utilizes the interface's optical function for bond formation.
Researchers have identified a precursor to a critical defect that affects silicon wafers used in any p-type solar cells. According to the team, these defects are known as the 'boron-oxygen complex' and are formed in places where electrons get 'trapped' within a semiconductor.
