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In today’s connected world, more and more products require both mechanical and electromagnetic design. Increased product complexity, higher performance demands, and the integration of these simulation domains are making the design cycle more involved. Meanwhile, the market is demanding faster product launches and lower costs.
Join us as we explore some of the design challenges companies are facing today, and how simulation is playing a key role in overcoming them. We will discuss thermal analysis, structural analysis, electromagnetic analysis – and how connected workflows can link these different domains to make the analysis process faster and more accurate. | 
