The eleventh Automotive Ethernet Congress will take place in Munich from February 18 to 20, 2025. Until October 14, you still have the opportunity to submit proposals for presentations and workshops.

Trinasolar's Research Centre Academy has achieved a breakthrough in solar module production with a recycling technology that uses materials such as silicon, silver, aluminium frames and glass from old modules. Trinasolar is thus continuing on its path towards greater sustainability.

Escatec, a swiss/malaysian electronics manufacturing services (EMS) provider, is marking its 40th anniversary, celebrating a significant milestone as the family-owned Group looks toward future growth.

With its new all-in-one solution »Secora Pay Bio« for biometric payment cards Infineon wants to enhance convenience and trust of biometric contactless payment. The solution uses a SoC secure element and a fingerprint sensor within a Biometric Coil on Module package.

The electronic displays Conference (edC) 2025 invites all experts and innovators in the field of display technologies to submit their contributions. Take this opportunity to present your research and developments to an international audience. The Call for Papers ends on October 7, 2024.

MVTec Software is launching version 24.11 of its standard machine vision software “Halcon” on November 20, 2024. According to MVTec, the new release offers, among other things, even better AI and deep learning algorithms than the previous edition.

The high-integrated crossover microcontrollers of the i.MX RT700 family from NXP Semiconductors are equipped with the “NXP eIQ Neutron” neural processing unit (NPU). They are designed for intelligent, AI-enabled edge systems such as wearables, medical devices, smart home solutions and HMI platforms.

Whoever wants to submit a presentation or workshop proposal for the embedded world Conference 2025 should hurry: The website for online submissions will only remain open until October 18.

As part of the EEmotion project, ZF and Infineon have developed and implemented AI algorithms for the development and control of vehicle software. During automated driving, the AI algorithms control all actuators according to the specified driving trajectory and optimise them.

The new conga-TCR8 Type 6 modules from Congatec work with up to eight Zen 4 Cores, an XDNA NPU and Radeon RDNA 3 graphics. They can deliver a performance of up to 39 TOPS for AI inference. The new modules are available in four variants.

STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power efficiency, power density and robustness and is optimized for traction inverters.

Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, CEA-Leti has paved the way to isolating piezoelectric converters without transformers.