To further the transformation of edge computing and AI, Kontron and Qualcomm will strengthen their cooperation. Qualcomm’s technology will be incorporated throughout Kontron’s lineup.

You want to visit Electronica in Munich and are interested in wireless? Then the business ticket is perfect for you to discover topics such as 6G, future wireless trends and more. Take the opportunity to learn from industry leaders and network with colleagues.

To further strengthen the EV Group´s position in semiconductor and adjacent markets, Alexander Rank will support the company’s management team as executive corporate functions director effective immediately.

We ask representatives of the wireless alliances supporting Wireless Congress 2024 about their personal Electronica story. We start with Graham Martin, Chairman & CEO of the EnOcean Alliance.

The new module family in COM Express Type 6 form factor by Tria Technologies is based on AMD Ryzen Embedded R2000 processors. The modules are ideal for automation, HMI systems and industrial image processing solutions. There are four variants available.

BASF and the Fraunhofer Institute for Photonic Microsystems IPMS are proud to look back on ten successful years of cooperation. Together, they have been working on innovative and customized solutions in the field of semiconductor production and chip integration as part of their »BASF Plating-Lab«.

The new 64 MHz MCUs from Renesas Electronics deliver outstanding power efficiency of only 69μA/MHz during active operation and 1μA in standby mode. They also enable designers to easily implement water-resistant capacitive touch sensors and deliver robust security.

With its new drives Western Digital offers a possibility to store up to 32TB per HDD. They are ideal for datacenters and cloud service providers. The new HDDs works with eleven disks.

Designed in partnership with other industry leaders, LDRA’s development and verification tool chain supports RISC-V developers from requirements through deployment and test.