Researchers demonstrate that dust-sized photovoltaic cells grown on silicon substrate can be heterogeneously integrated with other chiplets using a high-throughput wafer-level packaging process. The ability to integrate various nanoelectronic chiplets - such as processor, memory, and photovoltaics - in an industrial-scale wafer-level-packaging process, unlocks the potential of large-scale manufacturing of these compact integrated systems with high performance and ultralow cost.
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