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You Can Have It All:
Fast ROI, Small Footprint Automation for Electronics Assembly

A Free, Educational Webinar: Tuesday, May 15, 2018 • 2:00 p.m. ET

Once you’ve automated every possible process, how do you wring more costs out of your electronics production? Learn how small, lightweight collaborative robots (cobots) can help you automate manual processes such as final assembly, board testing, QA, and refurbishing applications—almost anything where floor space is at a premium and consistency is paramount. This webinar is presented by Universal Robots, the ISO 9001-certified industry pioneer in collaborative robots, with more than 20,000 cobots deployed worldwide.

In this one-hour webinar we’ll cover:

Applications where cobots’ small footprint, low upfront costs, and easy programming drive fast ROI in environments from job shops to multinationals
How built-in collaborative safety mechanisms allow workers to enter robots’ work envelope, optimizing floor space utilization
How to automate collaborative work environments with manual up-stream or down-stream processes
Examples from case studies such as automotive subsystems through low-volume/high-mix specialty production
Outcomes of collaborative automation, including ROI calculations and impacts on quality, consistency, and employee turnover

About our Guests

Craig Tomita
Area Sales Manager -
Western Region
Universal Robots

Craig Tomita is the Area Sales Manager for the Western USA and Western Canada for Universal Robots. Mr. Tomita has over 30 years of experience in automation, industrial robotics, and machine vision and has worked at major automation companies including IAI America; Cognex; Bosch-Rexroth; Minarik; Adept Technologies; and Festo. He holds a BS in Marketing Research from the University of Southern California.

Philip Hollingsworth
Sr. Tech Support Engineer
Universal Robots

Phil Hollingsworth is the Senior Technical Support Engineer at Universal Robots. He was an R&D Program Manager for Parker Hannifin where he directed the research and development where he developed a hermetically sealed, laser welded, hydraulic accumulator for aerospace applications. He was a Stress Analyst for Rockwell International where he worked on space shuttle structures for acceptable stress levels. He held management, design, and applications engineering positions at California Linear Devices where he developed and implemented direct drive linear motors. He received his BS in mechanical engineering from Tennessee Technological University.

About our Host

Jennifer DeLaOsa
Associate Editor
Electronic Component News (ECN)

Jennifer DeLaOsa is the Associate Editor for Electronic Component News (ECN). Her responsibilities consist of print and online content creation, including daily newsletter deployments, weekly video series, articles, and blogs. She also provides trade show coverage, reporting on the latest industry advancements for design engineers. Jennifer has a Bachelor of Science in Computer Science with minors in Technical Writing and Music from Rutgers University in New Brunswick.